In this study, the effect of the annealing process on the microstructure and the stress distribution of the Magnesium Diboride wires were investigated. The presented microstructure properties of the Copper/Magnesium Diboride wires are characterized for the varous diameters fabricated by the Continuous Tube Forming and Filling (CTFF) by using Scanning Electron Microscopy (SEM) and Electron Dispersive Spectroscopy (EDS) and the stress distribution is calculated analytically. In this study, it is observed that values of stress components are maximum at the interface region of Copper/Magnesium Diboride wires
MAGNEZYUM DİBORÜR TELLERİN MİKRO YAPISI VE GERİLME ANALİZİ
Bu çalışmada, ısıl işlem prosesinin süperiletken Magnezyum Diborür tellerin mikro yapısına ve oluşan gerilme dağılımlarına etkisi incelenmektedir. Sürekli Tüp Biçimlendirme ve Doldurma (CTFF) prosesi ile farklı çaplarda üretilen süperiletken Bakır/Magnezyum Diborür tellerin mikro yapısı Taramalı Elektrom Mikroskopu
(SEM) ve Enerji Dağılım Spektroskopisi (EDS) kullanılarak karakterize edilmektedir ve gerilme dağılımı hesapları analitik olarak hesaplanmıştır. Bu çalışmada, Bakır/Magnezyum Diborür tellerin ara bölgesinde gerilme değerlerinin
maksimum değerde olduğu görülmektedir.
MICROSTRUCTURE AND STRESS ANALYSIS OF THE MAGNESIUM DIBORIDE WIRES
In this study, the effect of the annealing process on the microstructure and the stress distribution of the Magnesium Diboride wires were investigated. The presented microstructure properties of the Copper/Magnesium Diboride wires are characterized for the varous diameters fabricated by the Continuous Tube Forming and Filling (CTFF) by using Scanning Electron Microscopy (SEM) and Electron Dispersive Spectroscopy (EDS) and the stress distribution is calculated analytically. In this study, it is observed that values of stress components are maximum at the interface region of Copper/Magnesium Diboride wires.
Primary Language | TR |
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Journal Section | Articles |
Authors | |
Publication Date | January 13, 2015 |
Published in Issue | Year 2014 |