HCl Asit Çözeltisinde Sn-3Ag-0.5Cu Alaşımının Korozyon Kinetiği Üzerine İndiyum İlavesinin Etkisi

Year 2022, Issue: 34, 28 - 33, 31.03.2022

Serkan Oguz , Ahmet Mustafa Erer , Yunus Türen , Hayrettin Ahlatcı

https://doi.org/10.31590/ejosat.1062757

Abstract

Bu çalışmanın amacı potansiyodinamik polarizasyon indiyum ilaveli Sn-3Ag-0.5Cu alaşımının 1M HCl çözeltisinde korozyon davranışını araştırmaktır. Alaşım numunelerinin özellikleri SEM ve EDX analizleri ile incelenmiştir. SAC305 lehim alaşımına ağırlıkça % 0,5, 1 ve 2 ağırlıkça indiyum eklenmesiyle gösterilen polarizasyon analizleri, belirgin şekilde farklı korozyon potansiyellerine yol açmaz. Akımların neredeyse sabit olduğu gerçek bir pasivasyon bölgesi yerine yalancı pasifleştirme bölgesi gözlemlenir. Tarama aralığına göre, bu sözde pasif bölge bir yeniden etkinleştirme noktasına sahip değildir. Öte yandan, korozyon hızları, gümüşün ağırlıkça %0.5'lik indiyum ikamesinin korozyon hızının düşmesine neden olduğu bir model izler. Bununla birlikte, gümüşün indiyumla daha fazla değiştirilmesiyle korozyon hızı artar. Mikroyapı analiz sonuçlarına göre korozyon ürünlerinin oluşması ve kararlılıklarına sınırlar getiren boşluk ve gözenekli yapıların varlığını ortaya koyar.

Keywords

In-ilavesi, korozyon, mikroyapı, kurşunsuz lehim alaşımı, HCl

The Effect Of Indium Addition on The Corrosion Kinetics of Sn–3Ag–0.5Cu Alloy In HCl Acid Solution

Abstract

The aim of this study is to investigate the corrosion behavior of potentiodynamic polarization indium added Sn-3Ag-0.5Cu alloy in 1M HCl solution. SEM and EDX analyses were examined the properties of the alloy samples. Polarization analyses showed by the addition of 0.5, 1, and 2 wt.% indium to the SAC305 solder alloy does not lead to notably different corrosion potentials. The pseudo-passivation region is observed instead of a true passivation region that currents are nearly constant. By the scanning interval, this pseudo-passive region does not have a reactivation point. On the other hand, corrosion rates follow a pattern in which 0.5% wt of indium substitution of silver causes the corrosion rate to decrease. However, with further silver replacement by indium, the rate of corrosion increases. According to the results of microstructure analysis, the formation of corrosion products and the existence of voids and porous structures limit their stability.

Keywords

In-addition, corrosion, microstructure, Pb-free solder alloy, HCl

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