Research Article
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Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights

Year 2018, Volume: 31 Issue: 4, 1229 - 1244, 01.12.2018

Burcu Cıcek , Necmettin Sahın , Mahmut Alkan

Abstract

In this study, in order to provide heat
dissipation of the high power LEDs to be used for street illumination, U-shaped
cylindrical copper heat pipes are used. Thermal analysis of this system was
carried out numerically in the ANSYS Fluent software. Firstly, thermal analysis
was performed for different numbers, diameters and lengths of heat pipes and
optimum values were obtained. Afterwards, the optimum materials to be used as
components of LED packages were determined. In addition, the effect of the
power applied to the LED chip and of ambient temperature on the temperature
distribution of the whole system was examined.

Keywords

High Power LED's CFD Heat Pipe Thermal analysis

References

  • URL: https://www.iup.edu/energymanagement/howto/led-lighting-benefits/, 10 February (2018).
  • M. Arik, J. Prtroski, S. Weaver, Thermal challenges in the future generation solid state lighting applications: light emitting diodes, in: Proceedings of the ASME/1EEE International Packaging Technical Conference, Hawaii, (2001).
  • Y. Gu, N. Narendran, A non-contact method for determining junction tempera- ture of phosphor-convened white LEDs, Proc. SPIE 5187 (2004) 107–114.
  • J.Z. Hu, L.Q. Yang, M.W. Shin, Mechanism and thermal effect of delamination in light-emitting diode packages, Microelectron. J. 38 (2) (2007) 157–163.
  • Wang, J. C., Huang, H. S. ve Chen, S. L., 2007. Experimental investigations of thermal resistance of a heat sink with horizontal embedded heat pipes. International Communications in Heatand Mass Transfer, 34(8), 958-970.
  • Shen, S.C., Huang, H.J., Shaw, H.J., 2013, Design and Estimation of a MCPCB-Flat Plate Heat Pipe for LED Array Module, Proceedings of 2013 IEEE International Conference on Mechatronics and Automation August 4 - 7, Takamatsu, Japan.
  • Tang, Y., Ding, X., Li, Z., Li, B., 2014, A highpower LED device with chips directly mounted on heat pipes, Applied Thermal Engineering 66- 632-639.
  • Moon, S. H., Park, Y. W., Yang, H. M. (2016). A single unit cooling fins aluminum flat heat pipe for 100W socket type COB LED lamp. Applied Thermal Engineering.
  • Wang, M., Tao, H., Sun, Z., Zhang, C.,2017, The development and performance of the high power LED radiator. International Journal of Thermal Sciences, 113, 65-72.

Year 2018, Volume: 31 Issue: 4, 1229 - 1244, 01.12.2018

Burcu Cıcek , Necmettin Sahın , Mahmut Alkan

Abstract

References

  • URL: https://www.iup.edu/energymanagement/howto/led-lighting-benefits/, 10 February (2018).
  • M. Arik, J. Prtroski, S. Weaver, Thermal challenges in the future generation solid state lighting applications: light emitting diodes, in: Proceedings of the ASME/1EEE International Packaging Technical Conference, Hawaii, (2001).
  • Y. Gu, N. Narendran, A non-contact method for determining junction tempera- ture of phosphor-convened white LEDs, Proc. SPIE 5187 (2004) 107–114.
  • J.Z. Hu, L.Q. Yang, M.W. Shin, Mechanism and thermal effect of delamination in light-emitting diode packages, Microelectron. J. 38 (2) (2007) 157–163.
  • Wang, J. C., Huang, H. S. ve Chen, S. L., 2007. Experimental investigations of thermal resistance of a heat sink with horizontal embedded heat pipes. International Communications in Heatand Mass Transfer, 34(8), 958-970.
  • Shen, S.C., Huang, H.J., Shaw, H.J., 2013, Design and Estimation of a MCPCB-Flat Plate Heat Pipe for LED Array Module, Proceedings of 2013 IEEE International Conference on Mechatronics and Automation August 4 - 7, Takamatsu, Japan.
  • Tang, Y., Ding, X., Li, Z., Li, B., 2014, A highpower LED device with chips directly mounted on heat pipes, Applied Thermal Engineering 66- 632-639.
  • Moon, S. H., Park, Y. W., Yang, H. M. (2016). A single unit cooling fins aluminum flat heat pipe for 100W socket type COB LED lamp. Applied Thermal Engineering.
  • Wang, M., Tao, H., Sun, Z., Zhang, C.,2017, The development and performance of the high power LED radiator. International Journal of Thermal Sciences, 113, 65-72.
There are 9 citations in total.

Details

Primary Language English
Subjects Engineering
Journal Section Mechanical Engineering
Authors

Burcu Cıcek 0000-0002-1777-4980

Necmettin Sahın 0000-0002-5756-4216

Mahmut Alkan 0000-0003-3846-0689

Publication Date December 1, 2018
Published in Issue Year 2018 Volume: 31 Issue: 4

Cite

APA Cıcek, B., Sahın, N., & Alkan, M. (2018). Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights. Gazi University Journal of Science, 31(4), 1229-1244.
AMA Cıcek B, Sahın N, Alkan M. Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights. Gazi University Journal of Science. December 2018;31(4):1229-1244.
Chicago Cıcek, Burcu, Necmettin Sahın, and Mahmut Alkan. “Thermal Analysis of Chip on Board Packaging of High Power Led’s With Heat Pipe Using Cfd for Street Lights”. Gazi University Journal of Science 31, no. 4 (December 2018): 1229-44.
EndNote Cıcek B, Sahın N, Alkan M (December 1, 2018) Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights. Gazi University Journal of Science 31 4 1229–1244.
IEEE B. Cıcek, N. Sahın, and M. Alkan, “Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights”, Gazi University Journal of Science, vol. 31, no. 4, pp. 1229–1244, 2018.
ISNAD Cıcek, Burcu et al. “Thermal Analysis of Chip on Board Packaging of High Power Led’s With Heat Pipe Using Cfd for Street Lights”. Gazi University Journal of Science 31/4 (December 2018), 1229-1244.
JAMA Cıcek B, Sahın N, Alkan M. Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights. Gazi University Journal of Science. 2018;31:1229–1244.
MLA Cıcek, Burcu et al. “Thermal Analysis of Chip on Board Packaging of High Power Led’s With Heat Pipe Using Cfd for Street Lights”. Gazi University Journal of Science, vol. 31, no. 4, 2018, pp. 1229-44.
Vancouver Cıcek B, Sahın N, Alkan M. Thermal Analysis of Chip on Board Packaging of High Power Led’s with Heat Pipe Using Cfd for Street Lights. Gazi University Journal of Science. 2018;31(4):1229-44.