Abstract
References
- A. J. F. a. R. S. R. T. Naayagi, “Highpower bidirectional DC–DC converter for aerospace applications,” IEEE Trans. Pow. Electron, pp. 4366-4379, 2012.
- Y. K. I. L. v. J. L. S. Choi, “Isolated PFC converter based on an ADAB structure with harmonic modulation for EV chargers,” J. Power Electron., vol. 18, no. 2, pp. 383-394, 2018.
- Q. S. v. W. L. B. Zhao, “A practical solution of highfrequency-link bidirectional solid-state transformer based on,” IEEE Trasaction of Industrial Electronics, vol. 62, no. 7, pp. 4587-4597, 2015.
- Q. S. W. L. a. Y. S. Biao Zhao, “Overview of Dual-Active-Bridge Isolated Bidirectional DC-DC Converter for High-Frequency-Link Power-Conversion System,” IEEE TRANSACTIONS ON POWER ELECTRONICS, pp. 4091 - 4106, 2014.
- C.-M. Lai, “Development of a Novel Bidirectional DCDC Converter Topology with High Voltage Conversion Ratio for Electric Vehicles and DC-Microgrids,” 2016.
- D. Ravi, B. M. Reddy and P. Samuel, “Bidirectional dc to dc Converters: An Overview of Various Topologies, Switching Schemes and Control Techniques,” International Journal of Engineering and Technology, pp. 360 - 365, 2018.
- M. S. S. W. v. J. W. K. J. Biela, “SiC versus SiEvaluation of potentials for performance improvement of inverter and dc-dc converter systems by SiC power semiconductors,” IEEE Transaction on Industrial Electronics, pp. 2872-2882, 2011.
- N. Oswald, P. Anthony and B. Stark, “An Experimental Investigation of the Tradeoff between Switching Losses and EMI Generation with Hard-Switched All-Si, Si-SiC, and All-SiC Device Combinations,” IEEE Transactions on Power Electronics, pp. 2393-2409, 2014.
- Y. Xie, C. Chen, Z. Huang, T. Liu, Y. Kang and F. Luo, “High Frequency Conducted EMI Investigation on Packaging and Modulation for a SiC-Based High Frequency Converter,” IEEE Journal of Emerging and Selected Topics in Power Electronics, pp. 1789 - 1804, 2019.
- G.-J. Su, “Comparison of Si, SiC, and GaN based Isolation Converters for Onboard Charger Applications,” in 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 2018.
- M. H. Rashid, Power Electronics Handbook, Oxford: Butterworth-Heinemann is an imprint of Elsevier, 2018.
- K. Kostov, Design and Characterization of Single-Phase Power Filters, HELSINKI, 2009.
- M. Montrose and E. Nakauchi, Testing for EMC Compliance Approaches and Techniques, Canada: A JOHN WILEY & SONS, INC., PUBLICATION, 2004.
Abstract
Power converters are required to work faster and with higher power density with the developing technology. Therefore, the converter is expected to work in more than one direction. Usage of Dual Active Bridge DC-DC Converter is an example. To increase the power density of the converters, it is necessary to increase the switching frequency. In conventional Si MOSFET based converters, power losses are very high and cause high electromagnetic interferences at high frequencies. These disadvantages lead developers to the use of wide-band gap semiconductor based converters such as SiC However, SiC MOSFETs will also emit electromagnetic interference (EMI) above a certain frequency. In this study, the EMI, emitted at certain frequencies by the Dual Active Bridge (DAB) DC-DC Converter, is simulated by the LTspice. It was observed that the Si-based inverter parts of the DAB converter generate 10 V EMI on the linear base, that means 140 dBµV EMI on the logarithmic base, at 20 kHz. The SiC-based converter does not emit any noise at the same frequency. However, when the frequency was increased to 250 kHz, it was determined that the SiC based converter emitted 2.3 V noise on the linear base, thus 123 dBµV noise on the logarithmic base. This study shows that not only Si MOSFET’s but only SiC MOSFET’s emit EMI over a certain frequency.
Keywords
WBG SiC MOSFET Dual Active Bridge DC-DC Converter Electromagnetic Compatibility EMI LTspice
References
- A. J. F. a. R. S. R. T. Naayagi, “Highpower bidirectional DC–DC converter for aerospace applications,” IEEE Trans. Pow. Electron, pp. 4366-4379, 2012.
- Y. K. I. L. v. J. L. S. Choi, “Isolated PFC converter based on an ADAB structure with harmonic modulation for EV chargers,” J. Power Electron., vol. 18, no. 2, pp. 383-394, 2018.
- Q. S. v. W. L. B. Zhao, “A practical solution of highfrequency-link bidirectional solid-state transformer based on,” IEEE Trasaction of Industrial Electronics, vol. 62, no. 7, pp. 4587-4597, 2015.
- Q. S. W. L. a. Y. S. Biao Zhao, “Overview of Dual-Active-Bridge Isolated Bidirectional DC-DC Converter for High-Frequency-Link Power-Conversion System,” IEEE TRANSACTIONS ON POWER ELECTRONICS, pp. 4091 - 4106, 2014.
- C.-M. Lai, “Development of a Novel Bidirectional DCDC Converter Topology with High Voltage Conversion Ratio for Electric Vehicles and DC-Microgrids,” 2016.
- D. Ravi, B. M. Reddy and P. Samuel, “Bidirectional dc to dc Converters: An Overview of Various Topologies, Switching Schemes and Control Techniques,” International Journal of Engineering and Technology, pp. 360 - 365, 2018.
- M. S. S. W. v. J. W. K. J. Biela, “SiC versus SiEvaluation of potentials for performance improvement of inverter and dc-dc converter systems by SiC power semiconductors,” IEEE Transaction on Industrial Electronics, pp. 2872-2882, 2011.
- N. Oswald, P. Anthony and B. Stark, “An Experimental Investigation of the Tradeoff between Switching Losses and EMI Generation with Hard-Switched All-Si, Si-SiC, and All-SiC Device Combinations,” IEEE Transactions on Power Electronics, pp. 2393-2409, 2014.
- Y. Xie, C. Chen, Z. Huang, T. Liu, Y. Kang and F. Luo, “High Frequency Conducted EMI Investigation on Packaging and Modulation for a SiC-Based High Frequency Converter,” IEEE Journal of Emerging and Selected Topics in Power Electronics, pp. 1789 - 1804, 2019.
- G.-J. Su, “Comparison of Si, SiC, and GaN based Isolation Converters for Onboard Charger Applications,” in 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 2018.
- M. H. Rashid, Power Electronics Handbook, Oxford: Butterworth-Heinemann is an imprint of Elsevier, 2018.
- K. Kostov, Design and Characterization of Single-Phase Power Filters, HELSINKI, 2009.
- M. Montrose and E. Nakauchi, Testing for EMC Compliance Approaches and Techniques, Canada: A JOHN WILEY & SONS, INC., PUBLICATION, 2004.
Details
| Primary Language | English |
|---|---|
| Subjects | Engineering |
| Journal Section | Research Article |
| Authors | |
| Publication Date | December 31, 2020 |
| Published in Issue | Year 2020 Volume: 8 Issue: 4 |
