Kinetic Study on Copper Leaching in Electroplating Waste Sludge (EWS) with Ammonium Nitrate Solution (ANS)

Year 2019, Volume: 5 Issue: 1, 1 - 15, 27.06.2019

Gediz Uğuz , Feza Geyikçi

Abstract

The electroplating process, which is based on coating
the surface of materials with electric current and various heavy metals, has a
significant share in the industry. Heavy metals such as copper iron, which is
present in the resulting slurry of electroplating process, threaten the
environmental health. For this reason, these threats must be eliminated or
minimized. In this study, electroplating waste sludge (EWS), which is an
oxidized copper waste sludge, is leached with alkali reagents called ammonium nitrate
solution (ANS). The effects of  parameters on the leaching were examined, and
a kinetic model was developed. As a result of the study, the leaching rate
increased with increasing concentration of reagent solution, temperature, and stirring
speed, as well as decreasing dimension of the solid particle and solid to reagent
solution ratio. It was determined that the leaching reaction followed the mixed
kinetic controlled model, which includes two different leaching processes together
with reaction below 303  K to 323 K and
diffusion above 323 K to 343 K. The activation energies were calculated as 84.62
and 28.85 kJ/mol, respectively.

Keywords

Ammonium nitrate, Copper, Kinetic model, Leaching

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