Research Article
BibTex RIS Cite

DEVELOPMENT of Cu MATRIX COMPOSITE CONTACTORS REINFORCED by NICKEL COATED SiC

Year 2023, Volume: 11 Issue: 4, 894 - 904, 01.12.2023
https://doi.org/10.36306/konjes.1255596

Abstract

In this study, Cu-Ni coated SiC composite samples were produced by electric current assisted sintering (ECAS) method by adding electroless nickel coated SiC powders to copper powders produced by cementation method at the ratios of 0.5, 1 and 1.5 wt%. The relative densities of the produced samples were measured by Archimedes’ principle, their microstructures were examined by SEM-EDS, dominant phases were determined by XRD technique; microhardness and electrical conductivity measurements were made. The relative density of undoped copper was determined as 99.42% and the relative density value of Cu-Ni SiC composite samples decreased to 98.35% at most with increasing SiC ratio. The hardness values of Cu-Ni SiC composite samples increased from 120HV to 145HV with the addition of SiC; electrical conductivity values decreased from 90.41 IACS (International annealed copper standard) to 58.56 IACS.

References

  • G. Celebi Efe, S. Zeytin, and C. Bindal, “The effect of SiC particle size on the properties of Cu-SiC composites,” Materials and Design, vol. 36, pp. 633–639, Apr. 2012.
  • M. Barmouz, P. Asadi, M. K. Besharati Givi, and M. Taherishargh, “Investigation of mechanical properties of Cu/SiC composite fabricated by FSP: Effect of SiC particles’ size and volume fraction,” Materials Science and Engineering A, vol. 528, no. 3, pp. 1740–1749, Jan. 2011.
  • G. Celebi Efe, T. Yener, I. Altinsoy, M. Ipek, S. Zeytin, and C. Bindal, “The effect of sintering temperature on some properties of Cu-SiC composite,” Journal of Alloys and Compounds, vol. 509, no. 20, pp. 6036–6042, May 2011.
  • D. T. Tran, J. W. Choi, and Y. S. Yun, “Feasibility of direct conversion of copper present in waste printed circuit boards to oxidation-resistant materials employing eco-benign iron(III) sulfate and ascorbic acid,” Sustainable Materials and Technologies, vol. 33, Sep. 2022.
  • J. Huang, C. Gui, H. Ma, P. Li, W. Wu, and Z. Chen, “Surface metallization of PET sheet: Fabrication of Pd nanoparticle/polymer brush to catalyze electroless nickel plating,” Composites Science and Technology, vol. 202, Jan. 2021.
  • P. V. Racheva, N. P. Milcheva, F. Genc, and K. B. Gavazov, “A centrifuge-less cloud point extraction-spectrophotometric determination of copper(II) using 6-hexyl-4-(2-thiazolylazo)resorcinol,” Spectrochimica Acta - Part A: Molecular and Biomolecular Spectroscopy, vol. 262, Dec. 2021.
  • P. Sahoo and S. K. Das, “Tribology of electroless nickel coatings - A review,” Materials and Design, vol. 32, no. 4, pp. 1760–1775, Apr. 2011.
  • T. M. Reis, C. D. Boeira, F. L. Serafini, M. C. M. Farias, C. A. Figueroa, and A. F. Michels, “Micro-abrasive wear resistance of heat-treated electroless nickel-phosphorus coatings deposited on copper-beryllium alloy C17200,” Surface & Coatings Technology, vol. 438, p. 128374, 2022.
  • V. Genova, G. Pedrizzetti, L. Paglia, F. Marra, C. Bartuli, and G. Pulci, “Diffusion aluminide coating modified via electroless nickel plating for Ni-based superalloy protection,” Surface & Coatings Technology, vol. 439, p. 128452, 2022.
  • G. Celebi Efe, S. Zeytin, and C. Bindal, “The effect of SiC particle size on the properties of Cu–SiC composites,” Materials & Design (1980-2015), vol. 36, pp. 633–639, Apr. 2012.
  • S. C. Yener, T. Yener, and R. Mutlu, “A Process Control Method for the Electric Current Activated/Assisted Sintering System Based on the Container Consumed Power and Temperature Estimation,” Journal of Thermal Analysis and Calorimetry, vol. 134, no. 2, pp. 1243–1252, 2018.
  • T. Yener, S. C. Yener, and S. Zeytin, “Nb addition effect on microstructural properties of Ti–TiAl3 in situ composites produced by resistive sintering,” Journal of Thermal Analysis and Calorimetry, vol. 134, no. 2, pp. 1359–1365, 2018.
  • T. Yener, S. C. Yener, and R. Mutlu, “Finite Difference Analysis of a Resistive Sintering System Container,” Journal of Nanoelectronics and Optoelectronics, vol. 14, pp. 1–5, 2019.
  • A. Erdogan, T. Yener, and S. Zeytin, “Fast production of high entropy alloys (CoCrFeNiAlxTiy) by electric current activated sintering system,” Vacuum, vol. 155, no. May, pp. 64–72, 2018.
  • R. Orrù, R. Licheri, A. M. Locci, A. Cincotti, and G. Cao, “Consolidation/synthesis of materials by electric current activated/assisted sintering,” Materials Science and Engineering: R: Reports, vol. 63, no. 4–6, pp. 127–287, 2009.
  • G. Granata, U. Tsendorj, W. Liu, and C. Tokoro, “Direct recovery of copper nanoparticles from leach pad drainage by surfactant-assisted cementation with iron powder,” Colloids and Surfaces A: Physicochemical and Engineering Aspects, vol. 580, Nov. 2019.
  • R. Jhajharia, D. Jain, A. Sengar, A. Goyal, and P. R. Soni, “Synthesis of copper powder by mechanically activated cementation,” Powder Technology, vol. 301, pp. 10–15, Nov. 2016.
  • A. Selimov, K. Chu, and D. L. McDowell, “Effects of interdiffusion on shear response of semi-coherent {111} interfaces in Ni/Cu,” International Journal of Plasticity, vol. 157, Oct. 2022.
  • S. D. Park, D. Kim, and S. Y. Kim, “Effect of oxidation on mechanical properties of Ni/Cu interface: A density functional theory study,” Materials Today Communications, vol. 33, Dec. 2022.
Year 2023, Volume: 11 Issue: 4, 894 - 904, 01.12.2023
https://doi.org/10.36306/konjes.1255596

Abstract

References

  • G. Celebi Efe, S. Zeytin, and C. Bindal, “The effect of SiC particle size on the properties of Cu-SiC composites,” Materials and Design, vol. 36, pp. 633–639, Apr. 2012.
  • M. Barmouz, P. Asadi, M. K. Besharati Givi, and M. Taherishargh, “Investigation of mechanical properties of Cu/SiC composite fabricated by FSP: Effect of SiC particles’ size and volume fraction,” Materials Science and Engineering A, vol. 528, no. 3, pp. 1740–1749, Jan. 2011.
  • G. Celebi Efe, T. Yener, I. Altinsoy, M. Ipek, S. Zeytin, and C. Bindal, “The effect of sintering temperature on some properties of Cu-SiC composite,” Journal of Alloys and Compounds, vol. 509, no. 20, pp. 6036–6042, May 2011.
  • D. T. Tran, J. W. Choi, and Y. S. Yun, “Feasibility of direct conversion of copper present in waste printed circuit boards to oxidation-resistant materials employing eco-benign iron(III) sulfate and ascorbic acid,” Sustainable Materials and Technologies, vol. 33, Sep. 2022.
  • J. Huang, C. Gui, H. Ma, P. Li, W. Wu, and Z. Chen, “Surface metallization of PET sheet: Fabrication of Pd nanoparticle/polymer brush to catalyze electroless nickel plating,” Composites Science and Technology, vol. 202, Jan. 2021.
  • P. V. Racheva, N. P. Milcheva, F. Genc, and K. B. Gavazov, “A centrifuge-less cloud point extraction-spectrophotometric determination of copper(II) using 6-hexyl-4-(2-thiazolylazo)resorcinol,” Spectrochimica Acta - Part A: Molecular and Biomolecular Spectroscopy, vol. 262, Dec. 2021.
  • P. Sahoo and S. K. Das, “Tribology of electroless nickel coatings - A review,” Materials and Design, vol. 32, no. 4, pp. 1760–1775, Apr. 2011.
  • T. M. Reis, C. D. Boeira, F. L. Serafini, M. C. M. Farias, C. A. Figueroa, and A. F. Michels, “Micro-abrasive wear resistance of heat-treated electroless nickel-phosphorus coatings deposited on copper-beryllium alloy C17200,” Surface & Coatings Technology, vol. 438, p. 128374, 2022.
  • V. Genova, G. Pedrizzetti, L. Paglia, F. Marra, C. Bartuli, and G. Pulci, “Diffusion aluminide coating modified via electroless nickel plating for Ni-based superalloy protection,” Surface & Coatings Technology, vol. 439, p. 128452, 2022.
  • G. Celebi Efe, S. Zeytin, and C. Bindal, “The effect of SiC particle size on the properties of Cu–SiC composites,” Materials & Design (1980-2015), vol. 36, pp. 633–639, Apr. 2012.
  • S. C. Yener, T. Yener, and R. Mutlu, “A Process Control Method for the Electric Current Activated/Assisted Sintering System Based on the Container Consumed Power and Temperature Estimation,” Journal of Thermal Analysis and Calorimetry, vol. 134, no. 2, pp. 1243–1252, 2018.
  • T. Yener, S. C. Yener, and S. Zeytin, “Nb addition effect on microstructural properties of Ti–TiAl3 in situ composites produced by resistive sintering,” Journal of Thermal Analysis and Calorimetry, vol. 134, no. 2, pp. 1359–1365, 2018.
  • T. Yener, S. C. Yener, and R. Mutlu, “Finite Difference Analysis of a Resistive Sintering System Container,” Journal of Nanoelectronics and Optoelectronics, vol. 14, pp. 1–5, 2019.
  • A. Erdogan, T. Yener, and S. Zeytin, “Fast production of high entropy alloys (CoCrFeNiAlxTiy) by electric current activated sintering system,” Vacuum, vol. 155, no. May, pp. 64–72, 2018.
  • R. Orrù, R. Licheri, A. M. Locci, A. Cincotti, and G. Cao, “Consolidation/synthesis of materials by electric current activated/assisted sintering,” Materials Science and Engineering: R: Reports, vol. 63, no. 4–6, pp. 127–287, 2009.
  • G. Granata, U. Tsendorj, W. Liu, and C. Tokoro, “Direct recovery of copper nanoparticles from leach pad drainage by surfactant-assisted cementation with iron powder,” Colloids and Surfaces A: Physicochemical and Engineering Aspects, vol. 580, Nov. 2019.
  • R. Jhajharia, D. Jain, A. Sengar, A. Goyal, and P. R. Soni, “Synthesis of copper powder by mechanically activated cementation,” Powder Technology, vol. 301, pp. 10–15, Nov. 2016.
  • A. Selimov, K. Chu, and D. L. McDowell, “Effects of interdiffusion on shear response of semi-coherent {111} interfaces in Ni/Cu,” International Journal of Plasticity, vol. 157, Oct. 2022.
  • S. D. Park, D. Kim, and S. Y. Kim, “Effect of oxidation on mechanical properties of Ni/Cu interface: A density functional theory study,” Materials Today Communications, vol. 33, Dec. 2022.
There are 19 citations in total.

Details

Primary Language English
Subjects Engineering
Journal Section Research Article
Authors

Cemalettin Arvas 0000-0002-1074-6856

İbrahim Altınsoy 0000-0002-1178-2285

Tuba Yener 0000-0002-2908-8507

Gözde Efe 0000-0003-3912-6105

Publication Date December 1, 2023
Submission Date February 23, 2023
Acceptance Date July 30, 2023
Published in Issue Year 2023 Volume: 11 Issue: 4

Cite

IEEE C. Arvas, İ. Altınsoy, T. Yener, and G. Efe, “DEVELOPMENT of Cu MATRIX COMPOSITE CONTACTORS REINFORCED by NICKEL COATED SiC”, KONJES, vol. 11, no. 4, pp. 894–904, 2023, doi: 10.36306/konjes.1255596.