WETTING BEHAVIORS AND INTERFACIAL PROPERTIES OF SAC300, SAC305 AND SAC0307 TERNARY Pb-FREE SOLDER ALLOYS

Year 2017, Volume: 12 Issue: 4, 163 - 169, 20.10.2017

Ahmet Mustafa Erer

Abstract

The wetting behavior and interfacial
properties of molten SAC300, SAC305 and SAC0307 (Sn-Ag-Cu) Pb-free solder alloys
were investigated by sessile drop technique at various temperatures (250, 280
and 310°C) on Cu substrate in Ar atmosphere, as well as its dependence on time.
The contact angles of the Pb-free solder alloys on Cu substrate do not decrease
sharply with increasing temperature but change with time. The contact angles were
measured for SAC305, SAC300 and SAC0307 alloys and the lowest θ was obtained as
41.90°for SAC305 alloy at 310°C. The melting temperatures were examined which for
SAC305 Pb-free alloy is lower than those for SAC300, SAC0307 Pb-free alloys. The
formation of intermetallic compounds (IMC) between the Pb-free solder alloys and
the Cu substrate was observed.

Keywords

Pb-free Solder Alloy, Contact Angle, Sessile Drop Technique, IMC

References

• 1. Mookam, N. and Kanlayasiri, K., (2011). Journal of Alloys and Compounds, Vol:509, 6276-6279.
• 2. Erer, A.M., Candan, E., Güven, M.H., and Turen Y., (2011). European Physical Journal Applied Physics, Vol:54, 11302.
• 3. Plevachuk, Y., Hoyer, W., Kaban, I., Köhler, M., and Novakovic, R., (2010). Journal of Material Sciience, Vol:45, 2051-2056.
• 4. Arenas, M.F. and Acoff, V.L., (2004). Journal of Electronic Materials, Vol:33, No:12, pp:1452-1458.
• 5. Amore, S., Ricci, E., Borzone, G., and Novakovic, R., (2008). Materials Science and Engineering A, Vol:495, pp:108-112.
• 6. Duong, N.B., Ariga, T., Hussainand, L.B., and Ismail, A.B., (2008). Materials Transactions, Vol:49, No:6, pp:1462-1466.
• 7. Yoon, S.W., Choiand, W.K., and Lee, H.M., (1999). Scripta Materialia, Vol:40, No:3, pp:297–302.
• 8. Yuan, Y. and Lee, T.R., (2013). Surface Science Techniques, Springer Series in Surface Sciences, Vol:51, pp:3-34.
• 9. Kumar, G. and Prabhu, K.N., (2007). Advances in Colloid and Interface Science 133, 61–89.
• 10. Zhang, X., Yuan, Z., Zhao, H., Zang, L., and LI, J., (2010). Chinese Science Bulletin, Vol:55, pp:797-801.
• 11. Omac, F., Özyurek, D., and Erer, M., (2017). Investigation of the Wetting Properties of Ternary Lead-Free Solder Alloys on Copper Substrate, Acta Physica Polonocia- A, Vol:131.
• 12. Zhang, X., Matsuura, H., Tsukihashi, F., and Yuan, Z., (2012). Material Transactions, Vol:53, No:5, pp:926-931.
• 13. Candan, E., Atkinson, H.V., Turen, Y., Salaoru, I., and Candan, S., (2011). Journal of the American Ceramic Society, Vol:94, No:3, pp:867–874.
• 14. Zang, L., Yuan, Z., Xu, H., and Xu, B., (2011). Applied Surface Science, 257, 4877-4884.
• 15. Islam, M.N., Chan, Y.C., Rizvi, M.J., and Jillek, W., (2005). Journal of Alloys and Compounds, 400, 136-144.
• 16. Lee, L.M., Haliman, H., and Mohamad, A.A., (2013). Soldering&Surface Mount Technology, vol:25, no:1, pp:15–23.
• 17. Liang, J., Dariavach, N., Callahan, P., and Shangguan, D., (2006). Materials Transactions, Vol:47, No:2, pp:317-325.
• 18. Suganuma, K., Huh, S-H., Kim, K., Nakase, H., and Nakamura, Y., (2001). Materials Transactions, Vol:42, No:2, pp:286-291.
• 19. Gao, F., Takemoto, T., and Nishikawa, H., (2006). Materials Science and Engineering A, Vol:420, no:1-2, pp:39-46.
• 20. Vianco, P.T., (2000). Circuit World, Vol:25, no:1, pp:1207-1213.
• 21. Gong, J., Liu, C., Conway, P.P., and Silberschmidt, V.V., (2008). Acta Materiala, 56, 4291-4297.
• 22. Lee, L.M. and Mohamad, A.A., (2013). Advances in Materials Science and Engineering, Vol:2013.
• 23. Chen, S.W., Wang, C.H., Lin, S.K. and Chiu, C.N., (2007). Journal of Materials Science, Vol:18, no:1-3, 19-37.
• 24. Yu, D.Q. and Wang, L., (2008). Journal of Alloys and Compounds, Vol:458, no:1-2, 542–547.