MTA Fillapex ile kontamine olmuş dentin yüzeylerine uygulanılan çeşitli kanal patı çözücülerinin adeziv rezinlerin bağlanma dayanımına etkisi

Year 2022, Volume: 9 Issue: 3, 746 - 752, 26.12.2022

Cemile Kedici Alp Hanife Altınışık , Esra Özyurt

https://doi.org/10.15311/selcukdentj.1029985

Abstract

Amaç: Bu çalışmanın amacı, MTA Fillapex kök patı ile kontamine olmuş dentin yüzeylerine uygulanan farklı çözücülerin, adeziv rezinlerin pulpa odasındaki dentine mikrotensile bağlanma dayanımı (μTBS) üzerine etkisini değerlendirmektir.
Gereç ve Yöntem: Bu çalışma da pulpa odası açılmış ve pulpa artıkları temizlenmiş 50 adet insan üçüncü azı dişi kullanıldı. Tüm dentin yüzeylerine 5 dk MTA Fillapex uygulandı, örnekler 5 gruba ayrıldı, kanal patı farklı solüsyonlarla temizlendi (n = 10). (Solüsyonun uygulanmadığı kontrol grubu, Kloroform, Metil etil keton, Etil asetat, Endosolv R). Örnekler kullanılan adeziv sisteme göre iki alt gruba ayrıldı. Clearfil Tri-S Universal Bond (Kuraray), üreticinin talimatlarına göre self etch ve total etch olarak uygulandı. Daha sonra dişler kompozit rezin ile restore edildi ve mikrotensile bağlanma dayanımı testi için kullanılacak çubukları üretmek üzere kesitler alındı. Elde edilen veriler ANOVA ve Tukey testi ile analiz edildi.
Bulgular: Tüm total etch adeziv gruplarındaki ortalama μTBS değerleri, tüm self etch adeziv gruplarından istatistiksel olarak daha yüksekti (p <0.05). Kloroform + self-etch grubun μTBS'si diğer self etch gruplarından anlamlı derecede düşükken, Endosolv R + self etch grubunun μTBS diğer self etch gruplarına göre anlamlı düzeyde daha yüksekti. Kloroform + total etch grubunun μTBS'si diğer total etch gruplarından anlamlı olarak daha düşüktü (p <0.05). Endosolv R + total-etch grubunun μTBS'si metil etil keton + total-etch grubuna göre anlamlı derecede yüksek olduğu görüldü (p <0.05). Diğer materyaller arasında µTBS açısından istatistiksel olarak anlamlı bir fark yoktu (p> 0.05).
Sonuç: MTA Fillapex ile kontamine dentin yüzeylerine uygulanılan çözücüler self etch ve total etch adeziv rezinlerin bağlanma dayanımını etkilemektedir.

Keywords

Adeziv, MTA Fillapex, makaslama bağlanma dayanımı, solvent

The effect on the bond strength of adhesive resins of various resin sealer solvents applied to dentin surfaces contaminated with MTA Fillapex

Abstract

Background: The aim of this study was to evaluate the effect of different endodontic solvents applied to the dentin surfaces contaminated with MTA Fillapex root canal paste on microtensile bond strength (μTBS) of adhesive resins to pulp chamber dentin.
Materials and methods: 50 human third molars pulp chamber was perforated and the pulp residues were cleaned. MTA Fillapex was applied to all dentin surfaces for 5 min, the samples were divided into 5 groups, the paste was removed with different solutions. (n=10) (Without solution, Chloroform, Methyl ethyl ketone, Ethyl acetate, Endosolv R). The samples were divided into two subgroups according to the adhesive system used. Clearfil Tri-S Universal Bond (Kuraray) applied either self-etch mode and total-etch mode according to the manufacturer's instructions. The teeth were restored with a composite and sectioned to sticks for microtensile bond testing. Data were analysed by ANOVA and Tukey test.
Results: The mean μTBS values in all total etch adhesive groups was statistically higher than the all self etch adhesive groups (p<0.05). μTBS of the group (chloroform+self-etch) was significantly lower than,whereas μTBS of the group(Endosolv R+self etch) was significantly higher than the other self etch groups. μTBS of the group (chloroform+ total-etch) was significantly lower than the other total-etch groups (p<0.05). μTBS of the group(Endosolv R+total-etch) was significantly higher than the methyl ethyl ketone+total-etch group (p<0.05). There was no statistically significant difference in μTBS between the other materials (p>0.05).
Conclusion: Treating methods affect the dentin bonding strength of self etch and total etch adhesives.

Keywords

Adhesive, MTA Fillapex, microtensile bond strength, solvent

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