Heat alleviation from surfaces exposed to high heat
has been of prominence with the advent of new technologies in the electronic
industry. The usage of regular materials and alloys has been used to the hilt
and the manufacture of new alloys being slow and with the advent of Metal
Matrix Composites, their usage as heat dissipation materials has taken a front
row. This is the initiation into developing an MMC of Al6061 with silver coated
copper particles to be researched. The usage of Al6061 as a heat sink material
and the addition of copper to it to enhance the heat dissipation capability of
the material are found to yield encouraging results. This composite when
further heat treated yielded even good results that surpassed the usual Al6061
capability of heat augmentation by 39%. Taguchi analysis and ANOVA are
performed for the given data.
Journal Section | Articles |
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Authors | |
Publication Date | December 20, 2017 |
Submission Date | February 7, 2017 |
Published in Issue | Year 2018 |
IMPORTANT NOTE: JOURNAL SUBMISSION LINK http://eds.yildiz.edu.tr/journal-of-thermal-engineering