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Year 2021, , 1030 - 1038, 01.05.2021
https://doi.org/10.18186/thermal.931389

Abstract

References

  • [1] Jha, Chandra Mohan. Thermal Sensors_Principles and Applications for Semiconductor Industries. Principles of Chemical Sensors, 2009. https://doi.org/10.1007/b136378_3.
  • [2] Künzi, R. Thermal Design of Power Electronic Circuits. In CERN Accelerator School: Power Converters, CAS 2014 - Proceedings, 2018;311-327. https://doi.org/10.5170/CERN-2015-003.311.
  • [3] Miller, T.J.E. Power Electronics Devices, Drivers and Applications. Electronics and Power, 1987. https://doi.org/10.1049/ep.1987.0287.
  • [4] Al-Tae'y, K. A. , Eqbal H.A. and Jebur M. N. Experimental investigation of water cooled minichannel heat sink for computer processing unit cooling, Int. Journal of Engineering Research and Application, 2017; 38-49. https:// doi.org/10.9790/9622-0708013849
  • [5] Mallik, Sabuj, and Franziska Kaiser. Reliability Study of Subsea Electronic Systems Subjected to Accelerated Thermal Cycle Ageing. In Lecture Notes in Engineering and Computer Science, 2014. https://gala.gre.ac.uk/id/eprint/12319/.
  • [6] Yeo, Jiwon, Seiya Yamashita, Mizuki Hayashida, and Shigeru Koyama. A Loop Thermosyphon Type Cooling System for High Heat Flux. Journal of Electronics Cooling and Thermal Control, 2014;128-137. https://doi.org/10.4236/jectc.2014.44014.
  • [7] Ghobadi, Mehdi, and Yuri S. Muzychka. Heat Transfer and Pressure Drop in Mini Channel Heat Sinks. Heat Transfer Engineering, 2015;902-911. https://doi.org/10.1080/01457632.2015.965097.
  • [8] Hetsroni, G., A. Mosyak, and Z. Segal. Nonuniform Temperature Distribution in Electronic Devices Cooled by Flow in Parallel Microchannels. IEEE Transactions on Components and Packaging Technologies, 2001;16-23. https://doi.org/10.1109/6144.910797.
  • [9] Hejcik, Jiri, and Miroslav Jicha. Single Phase Heat Transfer in Minichannels. In EPJ Web of Conferences, 2014. https://doi.org/10.1051/epjconf/20146702034.
  • [10] Mehta, Balkrishna, and Sameer Khandekar. Local Experimental Heat Transfer of Single-Phase Pulsating Laminar Flow in a Square Mini-Channel. International Journal of Thermal Sciences, 2015;157-166. https://doi.org/10.1016/j.ijthermalsci.2015.01.008.
  • [11] Toyoda, Hiroyuki, and Yoshihiro Kondo. Heat Transfer Performance of Loop Thermosyphon Using Enhanced Boiling and Condensation Surfaces. Transaction on Control and Mechanical Systems, 2013;432-435.
  • [12] Jajja, Saad Ayub, Wajahat Ali, Hafiz Muhammad Ali, and Aysha Maryam Ali. Water Cooled Minichannel Heat Sinks for Microprocessor Cooling: Effect of Fin Spacing. Applied Thermal Engineering, 2014;76-82. https://doi.org/10.1016/j.applthermaleng.2013.12.007.
  • [13] Xie, X. L., Z. J. Liu, Y. L. He, and W. Q. Tao. Numerical Study of Laminar Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink. Applied Thermal Engineering, 2009;64-74. https://doi.org/10.1016/j.applthermaleng.2008.02.002.
  • [14] Joseph, A. and Rajkumar, M. R. A numerical study on natural convection in mini channel using water and water- alumina nanofluid, 10th National Conference on Technological Trends, 2009, pp. 119-124.
  • [15] Asif, A., Samee, M. and Khanm S. A.,. Comparative heat transfer analysis in different minichannel heat sinks, International Journal of Recent Research, 2017, pp. 41-45.
  • [16] Dabrowski, Pawel, Michal Klugmann, and Dariusz Mikielewicz. Selected Studies of Flow Maldistribution in a Minichannel Plate Heat Exchanger. Archives of Thermodynamics, 2017;135-148. https://doi.org/10.1515/aoter-2017-0020
  • [17] Muhammad, Nura Mu’Az, Nor Azwadi Che Sidik, Aminuddin Saat, and Bala Abdullahi. Effect of Nanofluids on Heat Transfer and Pressure Drop Characteristics of Diverging-Converging Minichannel Heat Sink. CFD Letters, 2019;104-119.
  • [18] Turkyilmazoglu, M. “MHD Natural Convection in Saturated Porous Media with Heat Generation/Absorption and Thermal Radiation: Closed-Form Solutions.” Archives of Mechanics, 2019;49-64. https://doi.org/10.24423/aom.3049.

A LOOP THERMOSYPHON FOR LIQUID COOLED MINICHANNELS HEAT SINK WITH PULSATE SURFACE HEAT FLUX

Year 2021, , 1030 - 1038, 01.05.2021
https://doi.org/10.18186/thermal.931389

Abstract

The period operation of power electronic acts as switching element, where the power dissipated consists of pulses at certain duty cycle, the semiconductor temperature oscillates and varies as a waveform. In the present study, an experimental investigation was carried out for a loop thermosyphon order to evaluate the effect of pulsate surface heat flux on the single-phase buoyancy driven convection of ethylene glycol flow through a minichannels heat sink with hydraulic diameter 1.5 mm. An electric heater block is used to supply the heat flux to minichannels heat sink in a rectangle waveform. The study is done at different heat flux frequencies of 2.777×10-3 Hz, 8.333×10-4 Hz, 5.555×10-4 Hz and 4.166×10-4 Hz, while the heat flux amplitude (2 watt), Rayleigh number (1864) and duty cycle (50 %) are kept constant. The results revealed that for a range of the measured frequency for the complete power cycle and due to unsteady state operation conditions, the pulse heat flux pattern is close to a rectangle-wave, this generates the fluid outlet temperature pattern close to a triangle-wave. The fluid outlet temperature increases with the decreases of heat flux frequency and tends to reach to the fluid outlet temperature for a constant and continuous heat flux case. Due to closed-loop of thermosyphon, the fluid inlet temperature is changed in pattern like that the fluid outlet temperature change.

References

  • [1] Jha, Chandra Mohan. Thermal Sensors_Principles and Applications for Semiconductor Industries. Principles of Chemical Sensors, 2009. https://doi.org/10.1007/b136378_3.
  • [2] Künzi, R. Thermal Design of Power Electronic Circuits. In CERN Accelerator School: Power Converters, CAS 2014 - Proceedings, 2018;311-327. https://doi.org/10.5170/CERN-2015-003.311.
  • [3] Miller, T.J.E. Power Electronics Devices, Drivers and Applications. Electronics and Power, 1987. https://doi.org/10.1049/ep.1987.0287.
  • [4] Al-Tae'y, K. A. , Eqbal H.A. and Jebur M. N. Experimental investigation of water cooled minichannel heat sink for computer processing unit cooling, Int. Journal of Engineering Research and Application, 2017; 38-49. https:// doi.org/10.9790/9622-0708013849
  • [5] Mallik, Sabuj, and Franziska Kaiser. Reliability Study of Subsea Electronic Systems Subjected to Accelerated Thermal Cycle Ageing. In Lecture Notes in Engineering and Computer Science, 2014. https://gala.gre.ac.uk/id/eprint/12319/.
  • [6] Yeo, Jiwon, Seiya Yamashita, Mizuki Hayashida, and Shigeru Koyama. A Loop Thermosyphon Type Cooling System for High Heat Flux. Journal of Electronics Cooling and Thermal Control, 2014;128-137. https://doi.org/10.4236/jectc.2014.44014.
  • [7] Ghobadi, Mehdi, and Yuri S. Muzychka. Heat Transfer and Pressure Drop in Mini Channel Heat Sinks. Heat Transfer Engineering, 2015;902-911. https://doi.org/10.1080/01457632.2015.965097.
  • [8] Hetsroni, G., A. Mosyak, and Z. Segal. Nonuniform Temperature Distribution in Electronic Devices Cooled by Flow in Parallel Microchannels. IEEE Transactions on Components and Packaging Technologies, 2001;16-23. https://doi.org/10.1109/6144.910797.
  • [9] Hejcik, Jiri, and Miroslav Jicha. Single Phase Heat Transfer in Minichannels. In EPJ Web of Conferences, 2014. https://doi.org/10.1051/epjconf/20146702034.
  • [10] Mehta, Balkrishna, and Sameer Khandekar. Local Experimental Heat Transfer of Single-Phase Pulsating Laminar Flow in a Square Mini-Channel. International Journal of Thermal Sciences, 2015;157-166. https://doi.org/10.1016/j.ijthermalsci.2015.01.008.
  • [11] Toyoda, Hiroyuki, and Yoshihiro Kondo. Heat Transfer Performance of Loop Thermosyphon Using Enhanced Boiling and Condensation Surfaces. Transaction on Control and Mechanical Systems, 2013;432-435.
  • [12] Jajja, Saad Ayub, Wajahat Ali, Hafiz Muhammad Ali, and Aysha Maryam Ali. Water Cooled Minichannel Heat Sinks for Microprocessor Cooling: Effect of Fin Spacing. Applied Thermal Engineering, 2014;76-82. https://doi.org/10.1016/j.applthermaleng.2013.12.007.
  • [13] Xie, X. L., Z. J. Liu, Y. L. He, and W. Q. Tao. Numerical Study of Laminar Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink. Applied Thermal Engineering, 2009;64-74. https://doi.org/10.1016/j.applthermaleng.2008.02.002.
  • [14] Joseph, A. and Rajkumar, M. R. A numerical study on natural convection in mini channel using water and water- alumina nanofluid, 10th National Conference on Technological Trends, 2009, pp. 119-124.
  • [15] Asif, A., Samee, M. and Khanm S. A.,. Comparative heat transfer analysis in different minichannel heat sinks, International Journal of Recent Research, 2017, pp. 41-45.
  • [16] Dabrowski, Pawel, Michal Klugmann, and Dariusz Mikielewicz. Selected Studies of Flow Maldistribution in a Minichannel Plate Heat Exchanger. Archives of Thermodynamics, 2017;135-148. https://doi.org/10.1515/aoter-2017-0020
  • [17] Muhammad, Nura Mu’Az, Nor Azwadi Che Sidik, Aminuddin Saat, and Bala Abdullahi. Effect of Nanofluids on Heat Transfer and Pressure Drop Characteristics of Diverging-Converging Minichannel Heat Sink. CFD Letters, 2019;104-119.
  • [18] Turkyilmazoglu, M. “MHD Natural Convection in Saturated Porous Media with Heat Generation/Absorption and Thermal Radiation: Closed-Form Solutions.” Archives of Mechanics, 2019;49-64. https://doi.org/10.24423/aom.3049.
There are 18 citations in total.

Details

Primary Language English
Subjects Engineering
Journal Section Articles
Authors

Kays A. Al-tae’y This is me 0000-0003-0433-4465

Ameer Abed Jaddoa This is me 0000-0001-5158-1827

Hussain Saad Abd This is me 0000-0002-9341-4119

Publication Date May 1, 2021
Submission Date July 9, 2019
Published in Issue Year 2021

Cite

APA Al-tae’y, K. A., Jaddoa, A. A., & Abd, H. S. (2021). A LOOP THERMOSYPHON FOR LIQUID COOLED MINICHANNELS HEAT SINK WITH PULSATE SURFACE HEAT FLUX. Journal of Thermal Engineering, 7(4), 1030-1038. https://doi.org/10.18186/thermal.931389
AMA Al-tae’y KA, Jaddoa AA, Abd HS. A LOOP THERMOSYPHON FOR LIQUID COOLED MINICHANNELS HEAT SINK WITH PULSATE SURFACE HEAT FLUX. Journal of Thermal Engineering. May 2021;7(4):1030-1038. doi:10.18186/thermal.931389
Chicago Al-tae’y, Kays A., Ameer Abed Jaddoa, and Hussain Saad Abd. “A LOOP THERMOSYPHON FOR LIQUID COOLED MINICHANNELS HEAT SINK WITH PULSATE SURFACE HEAT FLUX”. Journal of Thermal Engineering 7, no. 4 (May 2021): 1030-38. https://doi.org/10.18186/thermal.931389.
EndNote Al-tae’y KA, Jaddoa AA, Abd HS (May 1, 2021) A LOOP THERMOSYPHON FOR LIQUID COOLED MINICHANNELS HEAT SINK WITH PULSATE SURFACE HEAT FLUX. Journal of Thermal Engineering 7 4 1030–1038.
IEEE K. A. Al-tae’y, A. A. Jaddoa, and H. S. Abd, “A LOOP THERMOSYPHON FOR LIQUID COOLED MINICHANNELS HEAT SINK WITH PULSATE SURFACE HEAT FLUX”, Journal of Thermal Engineering, vol. 7, no. 4, pp. 1030–1038, 2021, doi: 10.18186/thermal.931389.
ISNAD Al-tae’y, Kays A. et al. “A LOOP THERMOSYPHON FOR LIQUID COOLED MINICHANNELS HEAT SINK WITH PULSATE SURFACE HEAT FLUX”. Journal of Thermal Engineering 7/4 (May 2021), 1030-1038. https://doi.org/10.18186/thermal.931389.
JAMA Al-tae’y KA, Jaddoa AA, Abd HS. A LOOP THERMOSYPHON FOR LIQUID COOLED MINICHANNELS HEAT SINK WITH PULSATE SURFACE HEAT FLUX. Journal of Thermal Engineering. 2021;7:1030–1038.
MLA Al-tae’y, Kays A. et al. “A LOOP THERMOSYPHON FOR LIQUID COOLED MINICHANNELS HEAT SINK WITH PULSATE SURFACE HEAT FLUX”. Journal of Thermal Engineering, vol. 7, no. 4, 2021, pp. 1030-8, doi:10.18186/thermal.931389.
Vancouver Al-tae’y KA, Jaddoa AA, Abd HS. A LOOP THERMOSYPHON FOR LIQUID COOLED MINICHANNELS HEAT SINK WITH PULSATE SURFACE HEAT FLUX. Journal of Thermal Engineering. 2021;7(4):1030-8.

IMPORTANT NOTE: JOURNAL SUBMISSION LINK http://eds.yildiz.edu.tr/journal-of-thermal-engineering