Al-13.6Cu-6Si alaşımının elektriksel ve ısıl özelliklerinin incelenmesi
Year 2024,
Volume: 13 Issue: 1, 94 - 98, 15.01.2024
Erkan Üstün
,
M. İzzettin Yılmazer
,
Emin Çadırlı
Abstract
Doğrusal olarak katılaştırılan Al-13.6Cu-6Si alaşımının elektriksel özelliklerinin hem katılaştırma hızına hem de sıcaklığa bağlı olarak nasıl değişim gösterdiği ve buna ek olarak yine aynı alaşımın termal özelliklerinin sıcaklığa göre nasıl bir davranış sergilediği araştırılmıştır. Bu çalışma kapsamında öncelikle alaşımın elektriksel özdirenç (ρ) ölçümleri dört nokta prob yöntemi ile yapılmış ve özdirencin sıcaklık katsayısı () hesaplanmıştır. Wiedemann−Franz ve Smith-Palmer denklemleri kullanılarak elde edilen deneysel bulgularla ısıl iletkenlik (K)-sıcaklık (T) arasındaki ilişki belirlenmiştir. 320–953 K sıcaklık aralığında DSC analizi yapılarak çizilen ısı akışı-sıcaklık eğrisinden entalpi (H) ve özısı (cp) değerlerine ek olarak alaşımın erime sıcaklığı da (TE) belirlenmiştir.
Supporting Institution
Bu proje Niğde Üniversitesi Bilimsel Araştırma Projeleri Birimi tarafından FEB 2011/08 kod numarası ile desteklenmiştir.
Project Number
FEB 2011/08
Thanks
Bu proje Niğde Üniversitesi Bilimsel Araştırma Projeleri Birimi tarafından FEB 2011/08 kod numarası ile desteklenmiştir. Yazarlar bu mali destek için Niğde Üniversitesi Bilimsel Araştırma Projesi'ne teşekkür eder.
References
- C. Kittel, Introduction to Solid State Physics, 6th. Ed., Wiley, New York , 1965.
- D.R. Poirier and G. H. Geiger, Transport Phenomena in Materials Processing, The Minerals, Metals & Materials Society, Warrendale, PA, 1994.
- E. Üstün and E. Çadırlı, Investigation of the microstructure and physical properties of directionally solidified ternary Al-8.8La-1.2Ni alloy. Journal of Alloys and Compounds, 855, 157731, 2021. https://doi.org/10.1016/j.jallcom.2020.157331.
- E. Çadırlı, M. Sahin, R. Kayalı, M. Arı, S. Durmuş, Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn–3.5 wt% Ag eutectic alloy. Journal of Materials Science: Materials in Electronics, 22, 1709–1714, 2011. https://doi.org/10.1007/s10854-011-0350-9.
- G.S. Kumar, G. Prasad and R.O. Pohl, Experimental determinations of the Lorenz number, Journal of Materials Science, 28, 4261–4272, 1993. https://doi.org/10.1007/BF01154931.
- H. Kaya, U. Böyük, Çadırlı, E. and N. Maraşlı, Influence of growth rate on microstructure, microhardness, and electrical resistivity of directionally solidified Al-7 wt% Ni hypo-eutectic alloy. Metals and Materials International, 19(1), 39-44, 2013. https://doi.org/10.1007/s12540-013-1007-4.
- U. Böyük, Physical and mechanical properties of Al-Si-Ni eutectic alloy. Metals and Materials International, 18(6), 933–938, 2012. https://doi.org/10.1007/s12540-012-6004-5.
- H. Kaya, E. Çadırlı and U. Büyük, Microstructure, microhardness, tensile, electrical, and thermal properties of the Al-Mn-xSi ternary alloys, Kavove Materialy Metallic Materials, 58(4), 275-285, 2020 https://doi.org/10.4149/km_2020_4_275.
- U. Böyük, H. Kaya, E. Çadırlı, N. Maraşlı, A. Ülgen, Investigation of the effect of solidification processing parameters on microhardness and determination of thermo–physical properties in the Zn–Cu peritectic alloy, Journal of Alloys and Compounds, 491(1-2), 143–148, 2010. https://doi.org/10.1016/ j.jallcom.2009.10.184.
Investigation of the electrical and thermal properties of Al-13.6Cu-6Si alloy
Year 2024,
Volume: 13 Issue: 1, 94 - 98, 15.01.2024
Erkan Üstün
,
M. İzzettin Yılmazer
,
Emin Çadırlı
Abstract
It has been investigated how the electrical properties of the directionally solidified Al-13.6Cu-6Si alloy change depending on both the solidification rate and temperature, and how the thermal properties of the same alloy behave according to the temperature. Within the scope of this study, first of all, the electrical resistivity (ρ) measurements of the alloy were made with the four-point method and the temperature coefficient of the resistivity () was calculated. The relationship between thermal conductivity (K) and temperature (T) was determined with the experimental findings obtained using the Wiedemann−Franz and Smith-Palmer equations. In addition to enthalpy of fusion (H) and specific heat (cp) values, the melting temperature (TE) of the alloy was determined from the heat flow-temperature curve drawn by performing DSC analysis in the temperature range of 320-953 K.
Project Number
FEB 2011/08
References
- C. Kittel, Introduction to Solid State Physics, 6th. Ed., Wiley, New York , 1965.
- D.R. Poirier and G. H. Geiger, Transport Phenomena in Materials Processing, The Minerals, Metals & Materials Society, Warrendale, PA, 1994.
- E. Üstün and E. Çadırlı, Investigation of the microstructure and physical properties of directionally solidified ternary Al-8.8La-1.2Ni alloy. Journal of Alloys and Compounds, 855, 157731, 2021. https://doi.org/10.1016/j.jallcom.2020.157331.
- E. Çadırlı, M. Sahin, R. Kayalı, M. Arı, S. Durmuş, Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn–3.5 wt% Ag eutectic alloy. Journal of Materials Science: Materials in Electronics, 22, 1709–1714, 2011. https://doi.org/10.1007/s10854-011-0350-9.
- G.S. Kumar, G. Prasad and R.O. Pohl, Experimental determinations of the Lorenz number, Journal of Materials Science, 28, 4261–4272, 1993. https://doi.org/10.1007/BF01154931.
- H. Kaya, U. Böyük, Çadırlı, E. and N. Maraşlı, Influence of growth rate on microstructure, microhardness, and electrical resistivity of directionally solidified Al-7 wt% Ni hypo-eutectic alloy. Metals and Materials International, 19(1), 39-44, 2013. https://doi.org/10.1007/s12540-013-1007-4.
- U. Böyük, Physical and mechanical properties of Al-Si-Ni eutectic alloy. Metals and Materials International, 18(6), 933–938, 2012. https://doi.org/10.1007/s12540-012-6004-5.
- H. Kaya, E. Çadırlı and U. Büyük, Microstructure, microhardness, tensile, electrical, and thermal properties of the Al-Mn-xSi ternary alloys, Kavove Materialy Metallic Materials, 58(4), 275-285, 2020 https://doi.org/10.4149/km_2020_4_275.
- U. Böyük, H. Kaya, E. Çadırlı, N. Maraşlı, A. Ülgen, Investigation of the effect of solidification processing parameters on microhardness and determination of thermo–physical properties in the Zn–Cu peritectic alloy, Journal of Alloys and Compounds, 491(1-2), 143–148, 2010. https://doi.org/10.1016/ j.jallcom.2009.10.184.